TSMC, Amkor and Arizona
Apple, Amkor, and TSMC ‘neath the Arizona Skies
If this news sounds familiar it’s because Apple confirmed its own deal with Amkor to package Apple Silicon at TSMC last November. This made Apple the “first and largest” customer at Amkor’s new manufacturing plant, which at that time was billed as the “largest advanced packaging facility in the US.”
Amkor and TSMC Collaborate on Advanced Packaging in Arizona
TAMC and Amkor Technology announced today a memorandum of understanding to collaborate on advanced packaging and test capabilities in Arizona. Under the agreement, TSMC will contract with Amkor’s outsourced semiconductor assembly and test (OSAT) services,
TSMC-Amkor chip packaging deal will boost Apple chip production in the US
TSMC is expanding the capabilities of its chip plant in Arizona by partnering with the US-based Amkor Technology to add advanced packaging and test capabilities. The move will result in more US-based Apple chip production in the future.
Amkor and TSMC team up for advanced packaging in the U.S. — CoWoS and InFo to make AI and HPC CPUs
Amkor and TSMC on Friday said they had signed a memorandum of understanding to bring TSMC’s proven advanced packaging technologies — chip-on-wafer-on-substrate (CoWoS) and int
TSMC and Amkor link up to bring advanced packaging stateside
Arizona looks like the place to be for US semiconductor manufacturing Taiwan's TSMC has inked a deal with US semiconductor outfit Amkor Technology to beef up advanced chip packaging on American
TSMC, Amkor strike chip packaging deal at planned US plant
Taiwan Semiconductor Manufacturing Company (TSMC) has signed an advanced semiconductor packaging and testing deal with Arizona-based Amkor Technology, which has been providing the Taiwanese company with semiconductor assembly and test services for many years.
TSMC, Amkor sign MOU for advanced packaging at US facility, Apple to be first customer
TSMC and Amkor Technology, the world's second-largest semiconductor packaging and testing firm, announced on October 4 the signing of a memorandum of understanding (MOU) to deliver advanced packaging and testing services in Arizona.
Amkor and TSMC to Expand Partnership and Collaborate on Advanced Packaging in Arizona
Amkor and TSMC have been closely collaborating to deliver high volume, leading-edge technologies for advanced packaging and testing of semiconductors to support critical markets such as high-performance computing and communications.
Diary of the deal: Years of courtship, pivotal helicopter ride brought TSMC to Phoenix
What led industry leader TSMC to choose Arizona? Phoenix and state economic officials worked hard for a deal long before the ...
The Taipei Times5h
TSMC signs deal with US chip test firm
As part of the agreement, TSMC, the world’s biggest contract chipmaker, would contract turnkey advanced packaging and test ...
TSMC Arizona president retires, successor named
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Hoodline3d
TSMC Ushers in New Leadership for Arizona Operations with Rose Castanares at the Helm
TSMC appoints Rose Castanares as the new president of its Arizona subsidiary, succeeding the retiring Brian Harrison.
World War II, dry weather and Motorola positioned Arizona for semiconductor success
Arizona has gradually shed its dependence on agriculture, tourism, housing and mining to build a diverse economy. The proof, ...
Arizona's semiconductor industry: What to know about the booming field
Seemingly overnight, Arizona has emerged as a big player in the rejuvenated U.S. semiconductor industry, What does that mean, ...